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This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices will also be briefly discussed. References behind each of the theories and mitigation practices are provided.
Author | EIA |
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Editor | EIA |
Document type | Standard |
Format | File |
ICS | 31.200 : Integrated circuits. Microelectronics
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Number of pages | 30 |
Year | 2006 |
Document history | |
Country | USA |
Keyword | EIA 002;002;EIA JP002 |