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EIA IPC/JEDEC-9703:2009
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EIA IPC/JEDEC-9703:2009
Mechanical Shock Test Guidelines for Solder Joint ReliabilityThis document establishes mechanical shock test guidelines for assessing solder joint reliability of Printed Circuit Board (PCB) assemblies from system to component level. The three main categories discussed within this document follow: 1. Methods to define mechanical shock use-conditions. 2. Methods to define system level, system board level and component test board level testing that correlate to the use-conditions. 3. Guidance on the use of experimental metrologies for mechanical shock tests.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| ICS | 31.190 : Electronic component assemblies
|
| Number of pages | 46 |
| Cross references | IPC 9703 (2009-03-18), IDT
|
| Year | 2009 |
| Document history | |
| Country | USA |
| Keyword | EIA 9703;9703 |
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