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EIA JEP 167:2013
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EIA JEP 167:2013
Characterization of Interfacial Adhesion in Semiconductor PackagesThis document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle. NOTE Inclusion in this directory of methods does not imply applicability to all die-package configurations.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| ICS | 31.080.01 : Semiconductor devices in general
|
| Number of pages | 30 |
| Year | 2013 |
| Document history | |
| Country | USA |
| Keyword | EIA 167;167;EIA JEP167 |
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