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EIA JESD 22-B112B:2018
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EIA JESD 22-B112B:2018
Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated TemperatureThe purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount soldering operation.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| ICS | 31.200 : Integrated circuits. Microelectronics
|
| Number of pages | 30 |
| Replace | EIA JESD 22-B112A (2009-10) |
| Year | 2018 |
| Document history | EIA JESD 22-B112B (2018-08) |
| Country | USA |
| Keyword | EIA JESD 22;EIA 22;EIA 22.B112B;22;EIA JESD22-B112B |
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